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|Oct 26, 2026 1:14 PM

HCLTech Partners with Rapidus for Next-Generation Semiconductor Technologies

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HCLTech Partners with Rapidus for Next-Generation Semiconductor Technologies

HCLTech has joined Japan-based semiconductor company Rapidus Corporation’s global ecosystem to support the development of next-generation semiconductors, including advanced 2-nanometre (2nm) chips.

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The partnership brings HCLTech’s semiconductor engineering expertise into Rapidus’ collaborative initiative, which aims to connect chip design companies with advanced manufacturing capabilities.

Rapidus announced its Collaborative Open Rapid Ecosystem (CORE) initiative on October 5, 2026. HCLTech is among the 17 companies selected as Design Solution Associates in the first phase of the initiative.

HCLTech to Support Semiconductor Design

Under the CORE initiative, Rapidus aims to build a network of companies that can support customers across different stages of semiconductor development. These include chip design, verification and other engineering activities required before manufacturing.

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HCLTech has more than three decades of experience in semiconductor engineering. Its capabilities include chip architecture, register-transfer level (RTL) design, verification, physical design, validation, testing and manufacturing support.

These services are important in the development of advanced semiconductors, where chip designers and manufacturing facilities need to work closely to meet performance, power efficiency and production requirements.

HCLTech’s participation is expected to connect its engineering capabilities with Rapidus’ developing semiconductor manufacturing ecosystem. However, the companies have not disclosed a specific financial value, investment commitment or chip production volume associated with this participation.

Rapidus Targets 2nm Chip Production in 2027

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Rapidus is developing advanced logic semiconductors using 2nm process technology. The company is building its semiconductor manufacturing facility in Chitose, Hokkaido, Japan, and has targeted mass production in 2027.

The CORE initiative is intended to help customers access the expertise required to develop advanced chips and prepare designs for manufacturing. Rapidus plans to expand the ecosystem to include other areas, such as electronic design automation (EDA) and semiconductor intellectual property (IP).

The initiative comes as demand for advanced chips increases, particularly for artificial intelligence (AI), high-performance computing and other applications that require greater computing capacity and energy efficiency.

Indian IT Companies Expand Semiconductor Presence

HCLTech is not the only Indian IT services company participating in the initiative. Infosys and Wipro are also among the companies included in Rapidus’ first group of 17 Design Solution Associates.

Their participation reflects the growing role of Indian technology services companies in semiconductor design and engineering. Beyond traditional IT services, these companies provide specialised engineering capabilities that support the development of chips and other electronic systems.

For HCLTech, joining the Rapidus ecosystem provides an opportunity to participate in a programme focused on next-generation chip development. The commercial impact will depend on how the ecosystem develops, the projects undertaken, and the eventual adoption of Rapidus’ manufacturing technology.

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Sheetal Singh

Sheetal Singh, Senior News Journalist, SightsIn Plus

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